With the rapid development of advanced manufacturing, aerospace systems, deep-earth energy exploration, and high-power electronics, temperature sensors are increasingly required to operate reliably under extremely harsh conditions. In environments involving high temperature, high pressure, corrosion, and radiation expo

As third- and fourth-generation semiconductor technologies continue to advance, the demand for materials capable of operating under extreme conditions—such as high temperature, high voltage, and high frequency—has grown significantly. Among the emerging wide-bandgap semiconductor materials, diamond has attr

High-borosilicate glass wafers and quartz glass wafers are widely used semiconductor substrate materials in MEMS devices, semiconductor packaging, optoelectronics, and advanced wafer processing systems.
Although both materials are based on SiO₂ glass systems, their differences in thermal stability, optical transmissio

In high-end manufacturing fields such as semiconductor packaging, micro-electro-mechanical systems (MEMS), and AR/VR optical devices, glass wafers have become one of the core basic materials due to their excellent dielectric properties, light transmittance and structural stability. The precise processing of glass wafer

There are essential differences in material properties between glass wafers (amorphous, mainly composed of silicon dioxide) and sapphire wafers (monocrystalline, α-alumina). These differences lead to significant variations in the adaptability, processing effects, process parameters and application scenarios of la

Quartz glass wafers are amorphous materials made from high-purity silicon dioxide (SiO₂) through processes such as electric melting, gas melting or chemical vapor deposition (CVD). With a purity generally above 99.99% and high-end products reaching 99.999% (5N grade) or higher, they possess excellent thermal stability

As Moore's Law approaches physical limits, the semiconductor industry is accelerating towards the "More than Moore" direction. Advanced packaging (such as 2.5D/3D packaging, Chiplet heterogeneous integration, co-packaged optics (CPO), and HBM stacking) has become a core path to improve chip performance, integration

As the semiconductor industry moves towards the "post-Moore era", advanced packaging has become a core path to sustain chip performance improvement and achieve high-density integration. With its unique physical, chemical and electrical properties, glass wafers are gradually replacing traditional silicon substrates and

Among glass wafers, JGS1, JGS2, and JGS3 all belong to the quartz glass series, with high-purity silicon dioxide (SiO₂) as the core component, while BF33 is borosilicate glass, which has significant compositional differences from the former three. Therefore, the four types have obvious differences in characteristics a

Under high temperature and high purity environments, the selection boundary between BF33 (borosilicate glass) and quartz glass is mainly determined by temperature threshold and purity requirements, supplemented by thermal expansion matching, chemical stability and cost control. The core conclusion can be summarized as